PN Type Package Designator Pb-Free Packages - Manufacturing Conversion Datecode, Refer to Note 1 Type of Plating / Finish Matte Tin Annealing Process Minimum Plating Thickness Does this Microchip Pb-free device meet RoHS compliance for the following 6 materials: Pb, Hg, Cr6+, Cd, and PBB / PBDE Total Mass (g) STANDARD20L SSOP .209inAll Date CodesMatte Tin150C / 1hr w/l 24 hours400 microinchesYes0.1642
PIC16F819T-I/SSTSL |
RFQ for PIC16F819T-I/SSTSL |
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| Technical/Catalog Information | PIC16F819T-I/SSTSL |
| Vendor | Microchip Technology |
| Category | Integrated Circuits (ICs) |
| Program Memory Size | 3.5KB (2K x 14) |
| RAM Size | 256 x 8 |
| Number of I /O | 16 |
| Package / Case | 20-SSOP |
| Speed | 20MHz |
| Controller Series | PIC16F |
| Oscillator Type | Internal |
| Packaging | Tape & Reel (TR) |
| Program Memory Type | FLASH |
| EEPROM Size | 256 x 8 |
| Core Processor | PIC |
| Data Converters | A/D 5x10b |
| Core Size | 8-Bit |
| Operating Temperature | -40°C ~ 85°C |
| Connectivity | I²C, SPI |
| Peripherals | Brown-out Detect/Reset, POR, PWM, WDT |
| Voltage - Supply (Vcc/Vdd) | 4 V ~ 5.5 V |
| Drawing Number | * |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | PIC16F819T I SSTSL PIC16F819TISSTSL PIC16F819T ISSTSL ND PIC16F819TISSTSLND PIC16F819T-ISSTSL |
| Product | Manufacturers | Pack | D/C | ||||||||
| PIC16F819T-I/SSTSL | - | - | - |